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3189

景碩 Semiconductor As of 2026-06-17 Updated daily after market close

steady quality, premium valuation.

1 active signal
Revenue ≥20%
This page refreshes daily after the close. Add 景碩 to your watchlist to track signal changes on your next visit.
Valuation 12Quality 53Growth 76Momentum 97Chips 86

Is 景碩 a buy? Fundamentals and valuation first

  • Above-average profitability.Operating margin is in the 56th market percentile. Latest quarterly ROE ≈ 1.9%.

  • Valuation is high.PE is in the 95th market percentile; within its own history, PE is around the 92th percentile.

  • Foreign investors are net buying.Foreign 20-day net flow ≈ 7.8% of volume (net buy).

  • Strong revenue growth.Latest monthly revenue YoY ≈ 33.0%, above the 20% growth threshold.

  • Signals are active now.On the latest data, signals such as Revenue YoY ≥ 20% are active — see the historical forward returns after each occurrence below.

Chip flow

Bullish +0.73
BearishNeutralBullish

Single-sided accumulation, concentration rising — bullish

  • Single-sided accumulation, concentration rising — bullish
  • 美商高盛 holds 8,828 lots
  • sellers have 12,805 lots left, ~314 sessions to clear

Window from 2026-01-17 · Price +234% · branches to 2026-06-17· TDCC to 2026-06-12

  • Largest holder 美商高盛 has accumulated 8,828 lots since the start (sold 20%), now trimming.
  • Main distributor 元大證券 peaked at 10,927 lots, has sold 45%, 5,961 left, paused recently.
  • TDCC big holders (absolute) >1000-lot holders +2.06pp, mid holders +23, retail -2.42pp — concentration shifting upward.
  • Foreign hedge-desk net short Net short -7,652 lots (inferred from branch profile, mostly hedging — not necessarily bearish, not case-confirmed).
Branch inventory reconstruction
Accumulating holders Branches that accumulated shares during the window and still hold positive inventory; they are the absorbing side.
Distributing sellers Branches that built inventory earlier and have been selling it down; the remaining number estimates what has not cleared.
Net-short desks Trading-desk branches with negative inventory or net selling, often hedge, offsetting, or short-term flow. It is not automatically a bearish view.
Accumulating
美商高盛永豐金-匯立台灣摩根士丹利兆豐證券美林凱基-站前
Distributing
元大證券富邦-新店富邦證券凱基元大-松江國票-敦北法人
Desks
own scale
永豐金證券摩根大通宏遠證券元富-總公司營業部
Price Accumulating & Distributing share one scale (comparable); Desks is independent. Zero is the baseline
Branch details Unit: lots

Accumulating

  • 美商高盛 +8,828
    sold 20%
  • 永豐金-匯立 +4,074
    sold 0%· still adding
  • 台灣摩根士丹利 +3,501
    sold 6%· still adding
  • 兆豐證券 +3,042
    sold 12%
  • 美林 +2,385
    sold 0%· still adding
  • 凱基-站前 +1,990
    sold 10%

Distributing

  • 元大證券 5,961 left
    sold 45%· paused recently
  • 富邦-新店 4,186 left
    sold 55%· paused recently
  • 富邦證券 4,319 left
    sold 43%· ~70 sessions to clear
  • 凱基 4,000 left
    sold 46%· ~48 sessions to clear
  • 元大-松江 1,393 left
    sold 70%· paused recently
  • 國票-敦北法人 2,109 left
    sold 48%· ~39 sessions to clear

Desks

  • 永豐金證券 -8,725
    unclassified
  • 摩根大通 -4,295
    hedge desk · will cover
  • 宏遠證券 -3,480
    unclassified
  • 元富-總公司營業部 -3,308
    unclassified
Still selling 12,805 lots ~314 sessions to bottom at most
Recent buy/sell force +7,750 absorbed / -3,846 sold buyers slightly ahead
Hedge-desk net short -6,730 lots potential cover-buying, not selling pressure
TDCC big holders · absolute-holding cross-check
>1000-lot holder share Retail (<400 lots) share Price (right axis)

Direction matches: big-holder share rose while retail share fell.

Describes chip flow, not investment advice. Branch data discloses only high-volume branches with ~1-day lag; TDCC is weekly. Inventory is a relative reconstruction from the window start, not absolute holdings.

Historical evidence

Signals active now

These signals are true on the latest data, with this stock's own historical forward-return stats after each occurrence.

Monthly revenue YoY ≥ 20% (from filing deadline)

Active · now 33.02%

Monthly revenue YoY ≥ 20%; event date is the first trading day after the filing deadline (no look-ahead).

92 historical occurrences (since 2007-04-23)
Average forward return after Monthly revenue YoY ≥ 20% (from filing deadline)。20-day: Win 45.9%, Sample 74, Median -0.86%, Excess +1.09%, Beat mkt rate 47.3%；60-day: Win 52.8%, Sample 72, Median +0.62%, Excess +6.15%, Beat mkt rate 45.8%；120-day: Win 48.6%, Sample 70, Median -0.99%, Excess +14.51%, Beat mkt rate 41.4%

120 days after: historical avg +19.43%

20-day +1.88%
60-day +9.1%
120-day +19.43%
20-day
60-day
120-day
Win
45.9%
52.8%
48.6%
Sample
74
72
70
Median
-0.86%
+0.62%
-0.99%
Excess
+1.09%
+6.15%
+14.51%
Beat mkt rate
47.3%
45.8%
41.4%

Over 70 occurrences, 120-day forward avg gained 19.43%, beat the market by 14.51 pts; win rate 48.6%.

Valuation regime and subsequent returns

Each day's PE is converted to its own-history percentile (as of that day), then we look at adjusted-close returns over the next 240 trading days by valuation regime.

PE percentile bandSample days240-day avg returnMedianWin rateAvg excess (vs index)
0-20 801-1.4% -1.3% 48.6% -16.8%
20-40 236-4.5% +2.3% 59.7% -21.8%
40-60 184-1.4% +10% 59.8% -13.6%
60-80 247-23.3% -36.2% 28.3% -25.6%
80-100 You are here1247+72.5% +19.9% 58.1% +47%

Percentiles use an expanding own-history window (no look-ahead); forward return is 240 trading days on adjusted close. Sample days overlap; distribution is indicative only.

Current PE ≈ 198.87, at the 92.2th percentile of its own history (80-100 band).

Valuation × momentum historical grid

Every day in its own history is bucketed by valuation tercile (own-history PE) and 60-day momentum sign into six cells; we show adjusted-close returns over the next 120 trading days per cell.

Valuation
Momentum
Cheap (own-history bottom 1/3)
Mid
Expensive (own-history top 1/3)
60-day momentum up
+3.6%
Win rate 64% Excess -4.6%
350d
+4.8%
Win rate 62.2% Excess -2.4%
196d
Now
+42%
Win rate 56.6% Excess +29.6%
896d
60-day momentum down
-1.9%
Win rate 45.2% Excess -7.5%
599d
-9.2%
Win rate 29.2% Excess -13.1%
113d
+11.2%
Win rate 48.3% Excess -0.1%
681d

Currently in “Expensive (own-history top 1/3) × 60-day momentum up”: across 896 historical days, 120-day forward avg gained 42%, win rate 56.6%, beat the market by 29.6%.

Days = trading days in this bucket; returns use adjusted prices, ex-costs. 60-day momentum: direction of this stock's price over the past 60 trading days.

Does this signal hold up across the market

Over the past 242 months, on average ~404 stocks per month met “monthly revenue YoY ≥ 20%”; their adjusted-close return over the next 60 trading days averaged 6.94% (equal-weighted), beating the market by 2.37 points on average, and outperformed the TAIEX total-return index in 64.5% of months.

Each month, equal-weighted 60-day forward adjusted return of all signal-matching stocks, then averaged across months; excess vs the TAIEX total-return index.

Signals not active (historical stats for reference)

These are not occurring now; historical samples shown for comparison.

252-day price high (breakout)

Pending

Adjusted close makes a new 252-day high; repeats within 20 days counted once.

27 times historically; 60-day forward avg +21.14%, win rate 60%, beating the market by +13.51 pts on average.

Foreign net buying for 5 straight days

Pending

Foreign net flow (ex-dealer) positive for 5 straight days; event on day 5; repeats within 20 days counted once.

59 times historically; 60-day forward avg +1.74%, win rate 45.6%, beating the market by -0.96 pts on average.

What does 景碩 do? Company profile

半導體業；IC封裝載板、PCB載板及光學產品 台灣證券交易所上市

Overview

景碩科技股份有限公司成立於2000年9月11日，總公司位於桃園市新屋區中華路1245號，2004年11月1日上市掛牌。董事長為廖賜政，執行長暨總經理為陳河旭。依2025年報，總公司/石磊廠在桃園新屋，另有清華廠與幼獅廠；依公開股本資料與公司基本資料，實收資本額約新台幣52.69億元，發行普通股約526,915,760股。截至2026年3月31日，員工合計6,921人，平均年齡35歲，平均服務年資6.46年；其中管理人員475人、研發及技術人員1,152人、作業人員5,294人。2026年3月29日前十大股東中，華瑋投資持股12.72%、華旭投資12.32%、華毓投資11.76%，三者均為和碩聯合科技100%持有；其他主要股東包含新制勞工退休基金2.98%、陳族元2.08%、花旗託管挪威中央銀行投資專戶1.37%、匯豐台灣受託管摩根士丹利國際有限公司投資專戶1.34%、匯豐台灣受託管英商高盛國際公司投資專戶0.78%。公司另持有或合併光學部門，重要子公司包括晶碩光學。

Business

景碩主要業務為IC封裝載板製造與銷售，產品包含PBGA、MCM BGA、CSP/Mini-BGA、Cavity Down與TEBGA、高散熱型基板、Flip Chip Substrates、Flip Chip CSP、COF、Core-less、All layer build up、Embedded pattern、Embedded passive、Copper bump、Package on Package、高頻寬堆疊封裝載板等。官網產品線列示SiP系統級封裝載板、PBGA、FCCSP、CSP、RF modules與FCBGA。依2025年報，2025年合併營收新台幣39,351,096仟元，年增28.87%；載板部門營收32,311,845仟元，占82.11%，光學部門7,039,251仟元，占17.89%。主要銷售地區為台灣25.63%、美國24.74%、中國大陸16.48%、日本12.63%、其他20.52%。主要產品為積體電路用BGA載板，用於半導體構裝時作為晶片載體與對外電路連接通道，銷售對象主要為國內外IC封裝、IC設計與系統業者。2025年主要客戶以匿名方式揭露：客戶A占19.51%、客戶B占9.23%、客戶C占5.21%，其他占66.05%，均與公司無關係。商業模式以客戶新產品設計認證、量產供貨、高階製程能力與產能配置為核心；高階ABF/FCBGA載板受AI伺服器、HPC、GPU、ASIC、CPU與資料中心記憶體需求帶動，BT/FCCSP/CSP/SiP/RF模組則支撐手機、通訊、記憶體、車用與消費電子等應用。

Outlook 2025–2028

2025年公司營運已明顯復甦：合併營收393.51億元、年增28.87%，合併稅後淨利27.17億元、年增104.15%；市場新聞亦指出2025年EPS約3.51元。公司2025年報引Prismark資料指出，2025至2030年全球IC封裝載板市場由149億美元增至250億美元，年複合成長率約10.9%；其中FC PGA/LGA/BGA，即ABF/FCBGA相關市場，2025至2030年複合成長率15.2%，為最主要成長項目；FCCSP/FC-DRAM約6.1%。2026至2028展望重點為：一、AI伺服器、HPC、CSP雲端資本支出、GPU與ASIC平台推升高層數、大尺寸、高速高頻ABF FC-BGA載板需求；二、資料中心與Storage帶動記憶體與FC-DRAM載板需求；三、公司擴充ABF FC-BGA載板產能，重點包含厚核心層與薄核心層製程、記憶體用超薄載板、SiP模組及高集積化通信模組，並適度配置BT載板產能；四、研發方向包含多晶片/Chiplet、高頻高速材料、玻璃核心載板、Co-Packaged Optics、嵌入主被動元件、AI伺服器運算晶片封裝載板高速傳輸與散熱技術。公司於2026年法說/新聞展望中預期2026年業績可較2025年明顯成長兩位數百分比，毛利率有機會逐季提升，並持續擴充ABF產能至2027年。主要風險包括玻纖布、銅箔、BT基板、膠膜、日系特殊膠片等材料短缺，銅價與金價上漲壓縮毛利率，美國關稅與地緣政治造成供應鏈重組，中國業者在中低階ABF/BT載板可能價格競爭，AI資本支出若放緩或客戶平台轉換不順將影響稼動率與產品組合。2028之後仍需觀察玻璃基板與CPO商業化時程，短期不宜視為確定營收貢獻。

Supply Chain

Upstream
  • 供應商A 2025年報匿名揭露之第一大供應商，2025年進貨金額新台幣2,194,093仟元，占年度進貨淨額14.23%，與景碩無關係；實際公司名稱未公開。
  • 供應商B 2025年報匿名揭露之第二大供應商，2025年進貨金額新台幣1,877,966仟元，占12.18%，與景碩無關係；實際公司名稱未公開。
  • 供應商C 2025年報匿名揭露之第三大供應商，2025年進貨金額新台幣1,425,048仟元，占9.24%，與景碩無關係；實際公司名稱未公開。
  • 味之素株式會社 日本上市公司，ABF材料為高階FCBGA載板關鍵材料；景碩年報未點名直接供應商，列為產業上游關鍵材料供應商。
  • 日東紡績株式會社 日本上市公司，高階玻纖布/T-Glass為ABF載板上游關鍵材料之一；景碩年報指出玻纖布短缺為風險，但未點名直接供應商。
Downstream
  • 客戶A 2025年報匿名揭露之第一大客戶，2025年銷售金額新台幣7,676,563仟元，占銷貨淨額19.51%，與景碩無關係；實際公司名稱未公開。
  • 客戶B 2025年報匿名揭露之第二大客戶，2025年銷售金額新台幣3,633,433仟元，占9.23%，與景碩無關係；實際公司名稱未公開。
  • 客戶C 2025年報匿名揭露之第三大客戶，2025年銷售金額新台幣2,051,382仟元，占5.21%，與景碩無關係；實際公司名稱未公開。
  • 日月光投資控股股份有限公司 3711 台股上市封測龍頭；日月光高雄廠覆晶封裝資料列示KINSUS為FCCSP車用基板合格供應商之一，屬下游封裝客戶/認證供應鏈關係。
  • 國內外IC設計、封裝與系統業者 公司年報明示銷售對象主要為國內外IC封裝、設計與系統業者，應用於CPU、GPU、ASIC、記憶體、控制器、通訊與AI伺服器等；多數客戶名稱未公開。

Competitors

  • 欣興電子股份有限公司 3037 台股上市，全球IC載板與PCB大廠，與景碩在ABF/FCBGA、BT載板及高階PCB市場競爭。
  • 南亞電路板股份有限公司 8046 台股上市，ABF與BT載板主要同業，與景碩、欣興常被市場並稱台灣ABF載板主要廠商。
  • Ibiden Co., Ltd. 日本上市公司，全球高階ABF/IC封裝載板重要競爭者；非台股掛牌。
  • Samsung Electro-Mechanics 韓國上市公司，封裝載板與電子零組件大廠；非台股掛牌。
  • Shinko Electric Industries 日本封裝載板與半導體封裝材料大廠；非台股掛牌。
  • Simmtech 韓國記憶體與IC載板供應商，景碩年報提及韓國同業SIMM TECH在記憶體晶片領域具較高市占；非台股掛牌。
  • AT&S 奧地利上市PCB與IC載板廠，在高階載板與先進封裝供應鏈具競爭關係；非台股掛牌。
Sources（12）

This company profile is compiled from public sources (annual reports, filings, news and analyst reports), not finlab backtest data; the 2025–2028 outlook contains forward-looking estimates and is for reference only.

Method and limitations

  • All returns use adjusted close (etl:adj_close), already adjusted for dividends and splits.
  • Excess return is measured against the TAIEX total-return index (dividends included).
  • Valuation regime and percentile stats use an expanding own-history window (no future data).
  • Revenue-signal event dates align to the first trading day after the filing deadline, avoiding look-ahead.
  • Event samples may overlap in time; stats describe historical distribution only and are less reliable when samples are few.

This page is historical statistics for educational purposes and is not investment advice. Investing involves risk; past performance does not indicate future results. Assess and bear the risk yourself before trading.