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Help me set up FinLab and analyze 3372 典範. Please read: https://finlab.finance/en/setup?stock=3372

3372

典範 Semiconductor As of 2026-06-17 Updated daily after market close

quality needs a look, fair valuation, no active signal today.

This page refreshes daily after the close. Add 典範 to your watchlist to track signal changes on your next visit.
Valuation 27Quality 21Growth 59Momentum 41Chips 84

Is 典範 a buy? Fundamentals and valuation first

  • Weak profitability.Operating margin is in the 21th market percentile. Latest quarterly ROE ≈ -0.4%.

  • Valuation is neutral.PE is in the 71th market percentile; within its own history, PE is around the 51th percentile.

  • Foreign investors are net buying.Foreign 20-day net flow ≈ 7.3% of volume (net buy).

Chip flow

Bullish +0.51
BearishNeutralBullish

Single-sided accumulation, concentration rising — bullish

  • Single-sided accumulation, concentration rising — bullish
  • 新加坡商瑞銀 holds 908 lots
  • sellers have 1,879 lots left, ~122 sessions to clear

Window from 2026-01-17 · Price -20% · branches to 2026-06-17· TDCC to 2026-06-12

  • Largest holder 新加坡商瑞銀 has accumulated 908 lots since the start (sold 16%), now trimming.
  • Main distributor 華南永昌-長虹 peaked at 1,404 lots, has sold 41%, 832 left, ~122 sessions to clear at the recent pace.
  • TDCC big holders (absolute) >1000-lot holders +0.83pp, mid holders +3, retail -2.04pp — concentration shifting upward.
  • Foreign hedge-desk net short Net short -159 lots (inferred from branch profile, mostly hedging — not necessarily bearish, not case-confirmed).
Branch inventory reconstruction
Accumulating holders Branches that accumulated shares during the window and still hold positive inventory; they are the absorbing side.
Distributing sellers Branches that built inventory earlier and have been selling it down; the remaining number estimates what has not cleared.
Net-short desks Trading-desk branches with negative inventory or net selling, often hedge, offsetting, or short-term flow. It is not automatically a bearish view.
Accumulating
新加坡商瑞銀美商高盛摩根大通第一金-高雄凱基-鳳山凱基-站前
Distributing
華南永昌-長虹凱基-台北港商野村華南永昌-台中富邦-新竹新光-高雄
Desks
own scale
凱基-科園國泰-板橋新光美好-富順
Price Accumulating & Distributing share one scale (comparable); Desks is independent. Zero is the baseline
Branch details Unit: lots

Accumulating

  • 新加坡商瑞銀 +908
    sold 16%
  • 美商高盛 +714
    sold 24%
  • 摩根大通 +646
    sold 23%
  • 第一金-高雄 +467
    sold 5%· still adding
  • 凱基-鳳山 +461
    sold 0%· still adding
  • 凱基-站前 +442
    sold 0%· still adding

Distributing

  • 華南永昌-長虹 832 left
    sold 41%· ~122 sessions to clear
  • 凱基-台北 719 left
    sold 30%· ~36 sessions to clear
  • 港商野村 34 left
    sold 88%· ~5 sessions to clear
  • 華南永昌-台中 155 left
    sold 41%· ~18 sessions to clear
  • 富邦-新竹 26 left
    sold 85%· paused recently
  • 新光-高雄 27 left
    sold 84%· ~3 sessions to clear

Desks

  • 凱基-科園 -583
    unclassified
  • 國泰-板橋 -539
    unclassified
  • 新光 -354
    unclassified
  • 美好-富順 -316
    unclassified
Still selling 1,879 lots ~122 sessions to bottom at most
Recent buy/sell force +1,312 absorbed / -714 sold buyers slightly ahead
Hedge-desk net short -108 lots potential cover-buying, not selling pressure
TDCC big holders · absolute-holding cross-check
>1000-lot holder share Retail (<400 lots) share Price (right axis)

Direction matches: big-holder share rose while retail share fell.

Describes chip flow, not investment advice. Branch data discloses only high-volume branches with ~1-day lag; TDCC is weekly. Inventory is a relative reconstruction from the window start, not absolute holdings.

Historical evidence

Valuation regime and subsequent returns

Each day's PE is converted to its own-history percentile (as of that day), then we look at adjusted-close returns over the next 240 trading days by valuation regime.

PE percentile bandSample days240-day avg returnMedianWin rateAvg excess (vs index)
0-20 0Insufficient data
20-40 0Insufficient data
40-60 You are here0Insufficient data
60-80 0Insufficient data
80-100 0Insufficient data

Percentiles use an expanding own-history window (no look-ahead); forward return is 240 trading days on adjusted close. Sample days overlap; distribution is indicative only.

Current PE ≈ 25.71, at the 50.7th percentile of its own history (40-60 band).

Valuation × momentum historical grid

Every day in its own history is bucketed by valuation tercile (own-history PE) and 60-day momentum sign into six cells; we show adjusted-close returns over the next 120 trading days per cell.

Valuation
Momentum
Cheap (own-history bottom 1/3)
Mid
Expensive (own-history top 1/3)
60-day momentum up
Insufficient data
(0d)
Now
Insufficient data
(0d)
Insufficient data
(0d)
60-day momentum down
Insufficient data
(0d)
Insufficient data
(0d)
Insufficient data
(0d)

Days = trading days in this bucket; returns use adjusted prices, ex-costs. 60-day momentum: direction of this stock's price over the past 60 trading days.

Signals not active (historical stats for reference)

These are not occurring now; historical samples shown for comparison.

252-day price high (breakout)

Pending

Adjusted close makes a new 252-day high; repeats within 20 days counted once.

22 times historically; 60-day forward avg -0.44%, win rate 45.5%, beating the market by -9.11 pts on average.

Monthly revenue YoY ≥ 20% (from filing deadline)

Pending

Monthly revenue YoY ≥ 20%; event date is the first trading day after the filing deadline (no look-ahead).

60 times historically; 60-day forward avg +8.05%, win rate 64.1%, beating the market by +0.48 pts on average.

Foreign net buying for 5 straight days

Pending

Foreign net flow (ex-dealer) positive for 5 straight days; event on day 5; repeats within 20 days counted once.

38 times historically; 60-day forward avg +4.31%, win rate 56.8%, beating the market by +1.02 pts on average.

What does 典範 do? Company profile

半導體業;IC封裝與測試(OSAT) 上櫃(證券櫃檯買賣中心)

Overview

3372 對應證券為上櫃普通股「典範」,公司全名為台灣典範半導體股份有限公司,英文名 Taiwan IC Packaging Corporation,英文簡稱 TICP。公司成立於1998年7月14日,前身為奔騰半導體股份有限公司,1998年9月更名為台灣典範半導體;總部與主要廠區位於高雄市前鎮區南二路一號(高雄加工出口區/加工出口區體系)。公司於2005年12月16日上櫃。董事長為束崇萬,總經理兼發言人為曾忠鶴,代理發言人為郭景玫;股務代理為元大證券。公開資料顯示股本約新台幣17.5324億元,已發行普通股約175,324,000股。2023年年報揭露員工人數為392人(含6名非員工董事);Yahoo股市2026/01/19資料列示公司股本1,753,240,000元。主要股東依2023年年報前十大股東資料包括創見資訊(2451,持股21,928,036股、12.51%)、唯科技股份有限公司(14,104,208股、8.04%)、連勝投資(6,134,375股、3.50%)、萬青投資(5,489,752股、3.13%)、禾成投資(5,274,456股、3.01%)、萬敏投資(4,707,573股、2.68%)、束崇萬(4,471,641股、2.55%)、萬銓投資(3,172,276股、1.81%)等;其中多數投資公司與束氏家族或董事長關係密切。

Business

典範是專業IC封裝及測試廠,商業模式以承接IC設計公司、IDM或晶圓相關客戶的委外封裝、測試與工程服務為主,收入主要為封裝與測試加工服務費,並非銷售自有品牌晶片。公司提供傳統導線架型封裝與較利基的先進基板/導線架型封裝測試,官網列示產品/服務包含TSOP、SOP、SSOP/TSSOP、QFN/DFN、Thin PKG、TQFP、QFP、LQFP、Thermal Enhanced、Image Sensor、LGA/Memory Card、封裝服務、特性分析、封裝設計、電性與熱模擬分析等。2023年年報營收結構為:先進基板或導線架型積體封裝及測試新台幣584,807千元、占67.87%;傳統導線架型積體封裝及測試256,866千元、占29.81%;其他20,020千元、占2.32%;合計861,693千元。MoneyDJ整理之2024年產品營收占比為:先進基板或導線架型積體封裝及測試約61%、傳統導線架型積體封裝及測試約36%。產品應用包括行動通訊、觸控IC、USB 3.0、相機與手機記憶卡、記憶卡/儲存相關產品、光學IC、指紋辨識IC、光學滑鼠、醫療用品、汽車感測用品、無線通訊、消費性電子與各式輕薄短小可攜裝置。公司競爭定位偏向成熟製程封裝、記憶卡封裝、超薄封裝與光學/感測相關利基產品,而非最先進晶圓級或CoWoS等高階先進封裝主流大廠路線。

Outlook 2025–2028

2025至2028年展望以復甦、產品組合改善與利基封裝轉型為核心。成長動能方面,IC封測長期受惠於台灣半導體垂直分工、IDM與IC設計公司持續委外、AI終端與邊緣AI、高功率快充、第三代半導體功率元件、高速高效能運算、記憶體裝置、車用感測、醫療與穿戴裝置等需求。公司2023年年報明確提及將因應AI、高功率快充、高速高效能運算與系統單晶片模組需求,開發AI學習晶片、第三代半導體化合物功率晶片、高速高效能記憶體、高階系統級晶片SMT Module、Flip Chip等封裝測試產品;官網也強調提供專業封裝測試、電性與熱模擬分析,並與材料及設備供應商合作掌握製程能力。營運面觀察,2023與2024年公司仍處虧損,Goodinfo顯示2023年營收約8.62億元、EPS -1.02元,2024年營收約9.04億元、EPS -1.06元,2025年營收約11億元、EPS -1.22元,2026年第一季營收約3.1億元、EPS -0.03元且毛利率轉為正數4.11%;Histock列示2026年1至3月累計營收309,683千元、年增35.9%,顯示需求較2025年同期回升,但全年獲利能否穩定轉正仍需追蹤稼動率、價格與產品組合。潛在擴產/新技術方向包括超薄IC、記憶卡、QFN/DFN、Image Sensor、AI與功率元件封測、SMT Module與Flip Chip相關製程。主要風險包括:傳統導線架封裝競爭激烈且價格導向、規模經濟不及日月光投控等大型OSAT、產能利用率不足導致固定成本壓力、客戶認證週期與訂單能見度、原材料與設備成本、匯率、景氣循環、封測同業擴產造成報價壓力、資安與生產中斷風險。2025至2028年的具體營收或獲利數字未見公司正式財測,本欄對中長期成長動能屬依公司年報揭露技術方向與產業趨勢推估。

Supply Chain

Upstream
  • 長華科技 8070 IC封裝產業常見上游材料供應鏈,產品涵蓋導線架等封裝材料;此為產業鏈關係推估,未確認為典範直接供應商。
  • 順德工業 2351 台灣導線架與電子零件材料供應商,屬IC封裝上游材料鏈;未確認為典範直接供應商。
  • 欣興電子 3037 IC載板/PCB供應商,屬先進基板型封裝可能上游;未確認為典範直接供應商。
  • 景碩科技 3189 IC載板供應商,屬封裝基板上游;未確認為典範直接供應商。
  • 南電 8046 IC載板供應商,屬封裝基板上游;未確認為典範直接供應商。
  • 住友電木等封裝膠材供應商 封裝膠材/模封材料為IC封裝上游關鍵材料;住友電木為日本企業,非台股掛牌,未確認為典範直接供應商。
  • DISCO、東京精密等半導體後段設備商 切割、研磨、測試與封裝設備屬OSAT上游設備鏈;多為日本或海外公司,非台股掛牌,未確認為典範直接供應商。
Downstream
  • IC設計公司與IDM客戶 典範主要承接IC封裝與測試服務,下游客戶通常為IC設計公司、IDM、晶圓與系統模組客戶;公司未完整揭露客戶名單。
  • 創見資訊 2451 2023年年報揭露創見資訊為典範主要股東;創見從事記憶體模組與儲存產品,與典範記憶卡/儲存應用封裝具產業關聯,但公開資料未確認其為直接客戶。
  • 盛群半導體 6202 MCU與消費/控制IC設計公司,屬典範MCU、控制IC等封測服務的典型下游客群類型;未確認為典範直接客戶。
  • 瑞昱半導體 2379 通訊與控制IC設計公司,屬高速介面、通訊與控制IC封測的典型下游客群類型;未確認為典範直接客戶。
  • 聯詠科技 3034 驅動IC設計公司,屬Controller/Driver封測應用的典型下游客群類型;未確認為典範直接客戶。
  • 群聯電子 8299 NAND控制晶片與儲存方案公司,與記憶卡/儲存封裝應用具產業鏈關聯;未確認為典範直接客戶。

Competitors

  • 日月光投控 3711 年報列示先進IC封裝競爭者含ASX-ASE Technology Holding;台灣大型OSAT龍頭,規模、客戶與先進封裝能力均顯著高於典範。
  • 華泰電子 2329 年報列為導線架IC封裝國內競爭者(Orient Semiconductor Electronics)。
  • 矽格 6257 年報列為導線架IC封裝國內競爭者(Sigurd),亦為台灣主要IC測試/封測公司。
  • 菱生精密 2369 年報列為導線架IC封裝國內競爭者(Lingsen)。
  • 京元電子 2449 台灣主要IC測試服務公司,雖非年報列名導線架封裝競爭者,但在半導體後段測試市場與OSAT客戶預算競爭。
  • 欣銓科技 3264 台灣IC測試服務公司,在晶圓測試與成品測試領域與封測供應鏈部分重疊。
  • 南茂科技 8150 記憶體、驅動IC等封測公司,與典範在部分成熟封測與記憶體/驅動IC應用可能競爭。
Sources(11)

This company profile is compiled from public sources (annual reports, filings, news and analyst reports), not finlab backtest data; the 2025–2028 outlook contains forward-looking estimates and is for reference only.

Method and limitations

  • All returns use adjusted close (etl:adj_close), already adjusted for dividends and splits.
  • Excess return is measured against the TAIEX total-return index (dividends included).
  • Valuation regime and percentile stats use an expanding own-history window (no future data).
  • Revenue-signal event dates align to the first trading day after the filing deadline, avoiding look-ahead.
  • Event samples may overlap in time; stats describe historical distribution only and are less reliable when samples are few.

This page is historical statistics for educational purposes and is not investment advice. Investing involves risk; past performance does not indicate future results. Assess and bear the risk yourself before trading.