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3374

精材 Semiconductor As of 2026-06-17 Updated daily after market close

strong quality, fair valuation.

2 active signals
Revenue ≥20% Foreign buy
This page refreshes daily after the close. Add 精材 to your watchlist to track signal changes on your next visit.
Valuation 24Quality 82Growth 82Momentum 83Chips 25

Is 精材 a buy? Fundamentals and valuation first

  • Top-tier profitability.Operating margin beats ~88% of the market. Latest quarterly ROE ≈ 3.9%.

  • Valuation is neutral.PE is in the 74th market percentile; within its own history, PE is around the 90th percentile.

  • Foreign investors are net selling.Foreign 20-day net flow ≈ -1.7% of volume (net sell).

  • Strong revenue growth.Latest monthly revenue YoY ≈ 43.3%, above the 20% growth threshold.

  • Signals are active now.On the latest data, signals such as Revenue YoY ≥ 20%, Foreign net buying 5 straight days are active — see the historical forward returns after each occurrence below.

Chip flow

Bearish -0.69
BearishNeutralBullish

Distribution to retail — bearish

  • Distribution to retail — bearish
  • 國泰-敦南 holds 868 lots
  • sellers have 7,434 lots left, ~167 sessions to clear

Window from 2026-01-17 · Price +36% · branches to 2026-06-17· TDCC to 2026-06-12

  • Largest holder 國泰-敦南 has accumulated 868 lots since the start (sold 5%), still adding.
  • Main distributor 凱基-台北 peaked at 8,610 lots, has sold 85%, 1,315 left, paused recently.
  • TDCC big holders (absolute) >1000-lot holders -5.62pp, mid holders -3, retail +4.54pp — drifting down to retail.
  • Foreign hedge-desk net short Net short -5,130 lots (inferred from branch profile, mostly hedging — not necessarily bearish, not case-confirmed).
Branch inventory reconstruction
Accumulating holders Branches that accumulated shares during the window and still hold positive inventory; they are the absorbing side.
Distributing sellers Branches that built inventory earlier and have been selling it down; the remaining number estimates what has not cleared.
Net-short desks Trading-desk branches with negative inventory or net selling, often hedge, offsetting, or short-term flow. It is not automatically a bearish view.
Accumulating
國泰-敦南中國信託兆豐-台中港兆豐-復興中國信託-忠孝富邦-新板
Distributing
凱基-台北美商高盛摩根大通新加坡商瑞銀富邦證券兆豐-新竹
Desks
own scale
國泰證券永豐金-匯立港商野村統一
Price Accumulating & Distributing share one scale (comparable); Desks is independent. Zero is the baseline
Branch details Unit: lots

Accumulating

  • 國泰-敦南 +868
    sold 5%· still adding
  • 中國信託 +748
    sold 0%
  • 兆豐-台中港 +663
    sold 0%
  • 兆豐-復興 +492
    sold 0%
  • 中國信託-忠孝 +344
    sold 0%· still adding
  • 富邦-新板 +342
    sold 0%· still adding

Distributing

  • 凱基-台北 1,315 left
    sold 85%· paused recently
  • 美商高盛 2,121 left
    sold 65%· ~167 sessions to clear
  • 摩根大通 2,702 left
    sold 47%· ~20 sessions to clear
  • 新加坡商瑞銀 1,108 left
    sold 76%· ~9 sessions to clear
  • 富邦證券 666 left
    sold 82%· ~10 sessions to clear
  • 兆豐-新竹 1,210 left
    sold 61%· paused recently

Desks

  • 國泰證券 -3,798
    unclassified
  • 永豐金-匯立 -3,523
    unclassified
  • 港商野村 -2,241
    hedge desk · will cover
  • 統一 -1,822
    unclassified
Still selling 7,434 lots ~167 sessions to bottom at most
Recent buy/sell force +2,515 absorbed / -3,957 sold sellers slightly ahead
Hedge-desk net short -4,661 lots potential cover-buying, not selling pressure
TDCC big holders · absolute-holding cross-check
>1000-lot holder share Retail (<400 lots) share Price (right axis)

Weak direction: big-holder share fell while retail share rose.

Describes chip flow, not investment advice. Branch data discloses only high-volume branches with ~1-day lag; TDCC is weekly. Inventory is a relative reconstruction from the window start, not absolute holdings.

Historical evidence

Signals active now

These signals are true on the latest data, with this stock's own historical forward-return stats after each occurrence.

Monthly revenue YoY ≥ 20% (from filing deadline)

Active · now 43.31%

Monthly revenue YoY ≥ 20%; event date is the first trading day after the filing deadline (no look-ahead).

56 historical occurrences (since 2015-03-30)
Average forward return after Monthly revenue YoY ≥ 20% (from filing deadline)。20-day: Win 52.6%, Sample 38, Median +1.37%, Excess +0.63%, Beat mkt rate 44.7%；60-day: Win 54.1%, Sample 37, Median +3.03%, Excess +3.36%, Beat mkt rate 45.9%；120-day: Win 45.7%, Sample 35, Median -8.05%, Excess +0.3%, Beat mkt rate 40%

120 days after: historical avg +10.44%

20-day +2.42%
60-day +9.07%
120-day +10.44%
20-day
60-day
120-day
Win
52.6%
54.1%
45.7%
Sample
38
37
35
Median
+1.37%
+3.03%
-8.05%
Excess
+0.63%
+3.36%
+0.3%
Beat mkt rate
44.7%
45.9%
40%

Over 35 occurrences, 120-day forward avg gained 10.44%, beat the market by 0.3 pts; win rate 45.7%.

Foreign net buying for 5 straight days

Active · now 6%

Foreign net flow (ex-dealer) positive for 5 straight days; event on day 5; repeats within 20 days counted once.

41 historical occurrences (since 2015-08-05)
Average forward return after Foreign net buying for 5 straight days。20-day: Win 57.5%, Sample 40, Median +3.26%, Excess +3.88%, Beat mkt rate 52.5%；60-day: Win 61.5%, Sample 39, Median +8.15%, Excess +6.96%, Beat mkt rate 43.6%；120-day: Win 59.5%, Sample 37, Median +6.07%, Excess +4.09%, Beat mkt rate 48.6%

120 days after: historical avg +13.81%

20-day +5.91%
60-day +12.42%
120-day +13.81%
20-day
60-day
120-day
Win
57.5%
61.5%
59.5%
Sample
40
39
37
Median
+3.26%
+8.15%
+6.07%
Excess
+3.88%
+6.96%
+4.09%
Beat mkt rate
52.5%
43.6%
48.6%

Over 37 occurrences, 120-day forward avg gained 13.81%, beat the market by 4.09 pts; win rate 59.5%.

Valuation regime and subsequent returns

Each day's PE is converted to its own-history percentile (as of that day), then we look at adjusted-close returns over the next 240 trading days by valuation regime.

PE percentile bandSample days240-day avg returnMedianWin rateAvg excess (vs index)
0-20 176+20% +22.5% 88.6% -3.5%
20-40 158-11.7% -11.3% 13.9% -11.7%
40-60 226+40.7% +36.9% 78.3% +0.8%
60-80 304+12.8% +3.5% 53.3% -13.2%
80-100 You are here34-40% -40.1% 0% -50.7%

Percentiles use an expanding own-history window (no look-ahead); forward return is 240 trading days on adjusted close. Sample days overlap; distribution is indicative only.

Current PE ≈ 47.57, at the 89.8th percentile of its own history (80-100 band).

Valuation × momentum historical grid

Every day in its own history is bucketed by valuation tercile (own-history PE) and 60-day momentum sign into six cells; we show adjusted-close returns over the next 120 trading days per cell.

Valuation
Momentum
Cheap (own-history bottom 1/3)
Mid
Expensive (own-history top 1/3)
60-day momentum up
+9.6%
Win rate 71% Excess +5.6%
107d
+3.1%
Win rate 47.5% Excess -7.2%
162d
Now
+5.3%
Win rate 46.6% Excess -8.7%
191d
60-day momentum down
+7.5%
Win rate 71.9% Excess +0.6%
171d
+15.5%
Win rate 60.6% Excess -0.9%
251d
+14.5%
Win rate 41.2% Excess +1.1%
136d

Currently in “Expensive (own-history top 1/3) × 60-day momentum up”: across 191 historical days, 120-day forward avg gained 5.3%, win rate 46.6%, lagged the market by 8.7%.

Days = trading days in this bucket; returns use adjusted prices, ex-costs. 60-day momentum: direction of this stock's price over the past 60 trading days.

Does this signal hold up across the market

Over the past 242 months, on average ~404 stocks per month met “monthly revenue YoY ≥ 20%”; their adjusted-close return over the next 60 trading days averaged 6.94% (equal-weighted), beating the market by 2.37 points on average, and outperformed the TAIEX total-return index in 64.5% of months.

Each month, equal-weighted 60-day forward adjusted return of all signal-matching stocks, then averaged across months; excess vs the TAIEX total-return index.

Signals not active (historical stats for reference)

These are not occurring now; historical samples shown for comparison.

252-day price high (breakout)

Pending

Adjusted close makes a new 252-day high; repeats within 20 days counted once.

14 times historically; 60-day forward avg +16.79%, win rate 61.5%, beating the market by +13.99 pts on average.

What does 精材 do? Company profile

半導體業；IC封裝測試、晶圓級封裝與晶圓測試 上櫃（證券櫃檯買賣中心）

Overview

3374 對應精材科技股份有限公司，英文名稱 Xintec Inc.，為上櫃普通股。公司成立於 1998-09-11，總部與主要營運據點位於桃園市中壢區吉林路 23 號 9 樓，並於中壢工業區設有 Line-A、Line-B、Line-C 廠區。股票於 2015-03-30 上櫃，產業別為半導體業。董事長暨總經理為陳家湘。依 2024 年報與 2024 永續報告書，實收資本額約新台幣 27.14 億元，流通在外普通股 271,364,316 股，2024-12-31 員工人數 1,445 人，2025-03-31 員工人數 1,473 人。主要股東依 2025-03-31 年報揭露為台灣積體電路製造股份有限公司 111,281,925 股、持股 41.01%，國泰人壽 13,118,000 股、持股 4.83%，蔡肇保 7,921,000 股、持股 2.92%，其後包括何宗翰、李國豐、林鳳文、台新人壽、新制勞工退休基金、全球人壽、廖光賢等。公司股利政策原則上以當年度稅後盈餘 35% 至 85% 為分派原則，現金股利比例原則不低於股利總額 50%；2024 年度盈餘分派案為每股現金股利 2.5 元。2024 年營收新台幣 70.60 億元、稅後淨利 16.70 億元、EPS 6.15 元；2025 年營收新台幣 72.39 億元、稅後淨利 13.54 億元、EPS 4.99 元，毛利率自 2024 年 35.3% 降至 2025 年 27.4%，主因包含測試產能投資、新廠折舊與產品組合變化。

Business

精材為台積電轉投資的專業晶圓級封裝與測試服務公司，核心商業模式是替晶圓代工、IDM、IC設計及感測器客戶提供晶圓級尺寸封裝、晶圓級後護層封裝與晶圓級測試服務，收取封裝加工、測試與客製化製程服務收入。主要產品與服務包括：1. 晶圓級尺寸封裝 WLCSP，應用於影像感測器、光學感測器、慣性感測器與新型生物辨識器；2. 晶圓級後護層封裝，應用於指紋辨識器、慣性感測器、MEMS 揚聲器、功率與類比/RF 元件；3. 晶圓級測試，尤其 300mm 十二吋晶圓 CP Testing，並逐步延伸至 Final Test。公司起家於 CMOS 影像感測器 CIS 的晶圓級封裝，是將晶圓層級封裝技術 WLCSP 商品化的重要廠商之一，技術涵蓋 TSV、Cu-TSV、RDL、玻璃貼合、特殊光學鍍膜、晶圓薄化、乾蝕刻、局部切割、Molding、TMV、C2W bonding、SiP 晶圓級封裝等。終端應用涵蓋智慧手機、平板、筆電、汽車、醫療、工業、安防監控、AR/VR、穿戴裝置與智慧眼鏡等。2025 年製程別營收結構依公司 2026-02-10 法說會資料：晶圓級尺寸封裝新台幣 32.56 億元、約 45%；晶圓級後護層封裝新台幣 3.75 億元、約 5%；測試服務新台幣 34.65 億元、約 48%。相較 2024 年，測試服務營收由新台幣 19.47 億元提升至 34.65 億元，年增約 78%，成為最大成長引擎；晶圓級尺寸封裝由 46.16 億元降至 32.56 億元；後護層封裝約持平。2024 年銷售地區以亞洲為主，亞洲銷售新台幣 69.748 億元、占 99%，美國占約 1%，歐洲接近 0%。2024 年主要銷貨客戶揭露為代號 A 公司新台幣 53.248 億元、占 75%，且與公司關係為具重大影響力之投資者；B 公司新台幣 12.461 億元、占 18%，未揭露名稱。基於揭露文字，A 公司極可能指台積電，但公司年報未直接列名，故本報告在 notes 標示為推估。

Outlook 2025–2028

2025 至 2028 年展望可分為成長動能與風險兩面。成長動能方面，第一，測試服務轉為主要成長引擎。公司 2025 年測試服務銷貨量為 1,311 千片十二吋晶圓，年增 106.4%，2025 年第四季單季測試銷貨量 456 千片十二吋晶圓，年增 115.7%；公司 2026 年法說會明確表示 2026 年測試產能持續增加，將帶動全年營收顯著成長，並預期上半年營收年增。第二，12 吋 CIS CSP 量產與產能擴充是中期主軸，2024 年報指出公司已逐步建立 12 吋封裝與加工技術，包含 12 吋 Cu-TSV 細線寬與銅導線高階影像感測晶片應用，2025 年起多項新技術逐步量產，2026 年法說會則指出 12 吋 CIS CSP 量產持續與產能擴充。第三，穿戴裝置、智慧眼鏡、AR/VR、車用 CIS、醫療與工業感測器是新應用方向；公司 2026 年法說會提到積極進行穿戴裝置相關 CSP 專案，包括智慧眼鏡用感測器及顯示裝置。第四，先進封裝長期市場趨勢有利。公司年報引用 Yole 資料指出先進封裝占整體封裝市場比重預期於 2025 年超過傳統封裝、2028 年市場規模上升至 786 億美元、占比達 55%、CAGR 約 10.05%；AI、5G、AIoT、自動駕駛、工業 4.0 與邊緣感測將推動封測與感測器需求。第五，台積電持股 41.01% 與晶圓代工生態系合作可強化 Turn-key service 與長期客戶關係。主要風險與挑戰包括：1. 智慧手機與部分 3D 感測需求成熟，客戶供應鏈分散可能使既有 3D 感測、DOE 或封裝需求下滑；2025 年法說會揭露 DOE 營收年減超過 4 成，車用 CIS 營收年減 7%，整體 CIS 近持平。2. 新廠與測試產能擴張造成折舊與開辦費上升，2025 年資本支出新台幣 29.45 億元、年增 94.4%，折舊攤提新台幣 9.80 億元、年增 62.6%，自由現金流轉為負 10.27 億元，若稼動率提升不如預期，毛利率與現金流承壓。3. 客戶集中度高，2024 年前兩大客戶合計占銷貨淨額 93%，單一策略客戶或大客戶拉貨變化將高度影響營收。4. 匯率、地緣政治、關稅與半導體循環風險；公司營收以美元計價比重高，且終端消費電子需求與中國、美國供應鏈政策變化仍具不確定性。5. 先進封裝與晶圓測試競爭加劇，國際 IDM、中國 WLCSP 廠與台灣封測同業均可能擴產或搶占客戶。整體而言，2026 年至 2028 年若測試稼動率、12 吋 CIS CSP、穿戴/智慧眼鏡與 SiP 晶圓級封裝順利放量，營收結構可由過去偏感測器封裝轉向測試與 12 吋先進封裝並行；但因擴產折舊、客戶集中與消費性電子波動，獲利彈性需以季度毛利率、測試銷貨量、資本支出與月營收驗證。

Supply Chain

Upstream
  • 台灣積體電路製造股份有限公司 2330 最大股東，持股 41.01%；亦為晶圓代工與策略合作夥伴，年報指出精材結合台積電半導體製造技術與自身晶圓級封裝專業，提供客戶 Turn-key service；部分銷貨客戶 A 公司具重大影響力投資者身分，推估可能為台積電，但公司未在銷貨客戶表直接列名。
  • SCHOTT 薄型玻璃供應商；非台股掛牌公司，年報列為主要原料供應商之一。
  • NEG（Nippon Electric Glass） 薄型玻璃供應商；日本公司，非台股掛牌，年報列為主要原料供應商之一。
  • 優美科（Umicore） 靶材供應商；比利時上市公司，非台股掛牌，年報列為主要原料供應商之一。
  • 有研 靶材供應商；年報列為主要原料供應商之一，非台股掛牌。
  • 臺灣萬騰榮 靶材供應商；年報列為主要原料供應商之一，未確認為台股上市櫃公司。
  • OKUNO 鍍金液供應商；日本化學材料公司，非台股掛牌，年報列為主要原料供應商之一。
  • 台灣道邦 綠漆供應商；年報列為主要原料供應商之一，未確認為台股上市櫃公司。
  • 瀚軒 研磨液供應商；年報列為主要原料供應商之一，未確認為台股上市櫃公司。
Downstream
  • 台灣積體電路製造股份有限公司 2330 策略客戶與最大股東；精材承接晶圓測試與部分中後段封裝/測試服務需求，法說會顯示測試服務為 2025 至 2026 年成長主軸。銷貨客戶 A 公司占 2024 年銷貨 75%，具重大影響力投資者身分，推估可能為台積電但未由年報直接列名。
  • A 公司 2024 年報揭露之最大銷貨客戶，銷貨新台幣 53.248 億元、占 75%，關係為具重大影響力之投資者；公司未揭露正式名稱，因此 stock_id 設 null。
  • B 公司 2024 年報揭露之第二大銷貨客戶，銷貨新台幣 12.461 億元、占 18%，與公司關係為無；公司未揭露正式名稱，因此 stock_id 設 null。
  • 豪威集團（OmniVision Group） CIS 感測器客戶與歷史合作關係來源；現屬韋爾股份體系、中國上市公司相關，非台股掛牌。近年是否仍為主要客戶未由精材最新年報直接列名，列為歷史與產業鏈相關下游客戶。
  • 車用、AR/VR、醫療、工業、穿戴與智慧眼鏡系統客戶 終端應用市場而非單一公司；精材產品用於車用 CIS、AR/VR 光學感測、醫療與工業感測、智慧眼鏡用感測器及顯示裝置等，實際客戶多未公開。

Competitors

  • 日月光投控 3711 台股上市封測龍頭，先進封裝、SiP、測試與系統級整合能力完整；與精材在先進封裝與測試大方向存在競爭，但精材更聚焦晶圓級感測器封裝與台積電生態系特定測試服務。
  • 京元電子 2449 台股上市測試大廠，晶圓測試與成品測試能力強；與精材在晶圓測試、感測器/IC 測試服務上具部分競爭。
  • 矽格 6257 台股上櫃封測與測試公司，與精材在半導體測試與部分封測服務上具競爭關係。
  • 欣銓 3264 台股上櫃 IC 測試服務公司，主要競爭面在晶圓測試、成品測試與工程測試服務。
  • 南茂 8150 台股上市封測公司，主要聚焦記憶體、驅動 IC 與相關封測，與精材在封測產業資源與測試服務上有部分競爭。
  • 同欣電 6271 台股上市混合積體電路、影像產品與陶瓷基板封裝廠，與精材在影像感測器封裝及車用/感測器應用鏈具部分競爭或替代關係。
  • 采鈺 6789 台股上市、台積電集團影像感測與光學元件相關公司，業務偏 CIS 後段彩色濾光片、微透鏡及光學元件製程；與精材同屬感測器供應鏈，部分客戶與應用可能重疊。
  • 晶方科技 中國 A 股上市 WLCSP 與影像感測器封裝競爭者；精材年報列為影像感測器/新型生物辨識器晶圓級封裝主要競爭對手，非台股掛牌。
  • 華天科技 中國 A 股上市封測公司；精材年報列為影像感測器/新型生物辨識器晶圓級封裝主要競爭對手，非台股掛牌。
  • 歐系 IDM 精材年報列為影像感測器/新型生物辨識器晶圓級封裝主要競爭對手之一，但未揭露具體公司；可能為歐洲整合元件製造商內部封裝能力，非台股掛牌。
Sources（12）

This company profile is compiled from public sources (annual reports, filings, news and analyst reports), not finlab backtest data; the 2025–2028 outlook contains forward-looking estimates and is for reference only.

Method and limitations

  • All returns use adjusted close (etl:adj_close), already adjusted for dividends and splits.
  • Excess return is measured against the TAIEX total-return index (dividends included).
  • Valuation regime and percentile stats use an expanding own-history window (no future data).
  • Revenue-signal event dates align to the first trading day after the filing deadline, avoiding look-ahead.
  • Event samples may overlap in time; stats describe historical distribution only and are less reliable when samples are few.

This page is historical statistics for educational purposes and is not investment advice. Investing involves risk; past performance does not indicate future results. Assess and bear the risk yourself before trading.