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Help me set up FinLab and analyze 6274 台燿. Please read: https://finlab.finance/en/setup?stock=6274

6274

台燿 Electronic Components As of 2026-06-17 Updated daily after market close

strong quality, premium valuation.

1 active signal
This page refreshes daily after the close. Add 台燿 to your watchlist to track signal changes on your next visit.
Valuation 13Quality 86Growth 94Momentum 99Chips 33

Is 台燿 a buy? Fundamentals and valuation first

  • Top-tier profitability.Operating margin beats ~80% of the market. Latest quarterly ROE ≈ 6.9%.

  • Valuation is high.PE is in the 92th market percentile; within its own history, PE is around the 100th percentile.

  • Foreign investors are net selling.Foreign 20-day net flow ≈ -0.8% of volume (net sell).

  • Strong revenue growth.Latest monthly revenue YoY ≈ 128.5%, above the 20% growth threshold.

  • Signals are active now.On the latest data, signals such as Revenue YoY ≥ 20% are active — see the historical forward returns after each occurrence below.

Chip flow

Bullish +0.82
BearishNeutralBullish

Single-sided accumulation, concentration rising — bullish

  • Single-sided accumulation, concentration rising — bullish
  • 台灣摩根士丹利 holds 11,343 lots
  • sellers have 6,013 lots left, ~396 sessions to clear

Window from 2026-01-17 · Price +255% · branches to 2026-06-17· TDCC to 2026-06-12

  • Largest holder 台灣摩根士丹利 has accumulated 11,343 lots since the start (sold 14%), now trimming.
  • Main distributor 新加坡商瑞銀 peaked at 4,608 lots, has sold 56%, 2,037 left, paused recently.
  • TDCC big holders (absolute) >1000-lot holders +5.42pp, mid holders -5, retail -3.24pp — concentration shifting upward.
  • Foreign hedge-desk net short Net short -671 lots (inferred from branch profile, mostly hedging — not necessarily bearish, not case-confirmed).
Branch inventory reconstruction
Accumulating holders Branches that accumulated shares during the window and still hold positive inventory; they are the absorbing side.
Distributing sellers Branches that built inventory earlier and have been selling it down; the remaining number estimates what has not cleared.
Net-short desks Trading-desk branches with negative inventory or net selling, often hedge, offsetting, or short-term flow. It is not automatically a bearish view.
Accumulating
台灣摩根士丹利摩根大通美商高盛法銀巴黎香港上海匯豐元大-竹科
Distributing
新加坡商瑞銀凱基-台北花旗環球港商麥格理大和國泰中國信託
Desks
own scale
永豐金證券元大證券元富國泰證券
Price Accumulating & Distributing share one scale (comparable); Desks is independent. Zero is the baseline
Branch details Unit: lots

Accumulating

  • 台灣摩根士丹利 +11,343
    sold 14%
  • 摩根大通 +7,404
    sold 0%· still adding
  • 美商高盛 +7,235
    sold 0%· still adding
  • 法銀巴黎 +1,657
    sold 5%
  • 香港上海匯豐 +1,151
    sold 8%· still adding
  • 元大-竹科 +581
    sold 0%· still adding

Distributing

  • 新加坡商瑞銀 2,037 left
    sold 56%· paused recently
  • 凱基-台北 2,230 left
    sold 46%· ~33 sessions to clear
  • 花旗環球 2,575 left
    sold 29%· ~396 sessions to clear
  • 港商麥格理 556 left
    sold 77%· ~47 sessions to clear
  • 大和國泰 431 left
    sold 42%· paused recently
  • 中國信託 372 left
    sold 42%· ~128 sessions to clear

Desks

  • 永豐金證券 -5,941
    unclassified
  • 元大證券 -3,848
    unclassified
  • 元富 -2,833
    unclassified
  • 國泰證券 -1,224
    unclassified
Still selling 6,013 lots ~396 sessions to bottom at most
Recent buy/sell force +3,972 absorbed / -1,180 sold buyers slightly ahead
Hedge-desk net short -590 lots potential cover-buying, not selling pressure
TDCC big holders · absolute-holding cross-check
>1000-lot holder share Retail (<400 lots) share Price (right axis)

Direction matches: big-holder share rose while retail share fell.

Describes chip flow, not investment advice. Branch data discloses only high-volume branches with ~1-day lag; TDCC is weekly. Inventory is a relative reconstruction from the window start, not absolute holdings.

Historical evidence

Signals active now

These signals are true on the latest data, with this stock's own historical forward-return stats after each occurrence.

Monthly revenue YoY ≥ 20% (from filing deadline)

Active · now 128.48%

Monthly revenue YoY ≥ 20%; event date is the first trading day after the filing deadline (no look-ahead).

72 historical occurrences (since 2007-04-23)
Average forward return after Monthly revenue YoY ≥ 20% (from filing deadline)。20-day: Win 55.4%, Sample 65, Median +2.16%, Excess +2.72%, Beat mkt rate 50.8%;60-day: Win 61.9%, Sample 63, Median +4.05%, Excess +9.17%, Beat mkt rate 55.6%;120-day: Win 65%, Sample 60, Median +3.58%, Excess +17.67%, Beat mkt rate 48.3%

120 days after: historical avg +27.31%

20-day +4.49%
60-day +14.85%
120-day +27.31%
20-day
60-day
120-day
Win
55.4%
61.9%
65%
Sample
65
63
60
Median
+2.16%
+4.05%
+3.58%
Excess
+2.72%
+9.17%
+17.67%
Beat mkt rate
50.8%
55.6%
48.3%

Over 60 occurrences, 120-day forward avg gained 27.31%, beat the market by 17.67 pts; win rate 65%.

Valuation regime and subsequent returns

Each day's PE is converted to its own-history percentile (as of that day), then we look at adjusted-close returns over the next 240 trading days by valuation regime.

PE percentile bandSample days240-day avg returnMedianWin rateAvg excess (vs index)
0-20 419+68.8% +60.1% 96.2% +57.9%
20-40 392+44.4% +22% 69.1% +34.7%
40-60 358+88.5% +24% 57.8% +71.4%
60-80 617+50.2% +11.8% 61.6% +30%
80-100 You are here1174+40.6% +23.4% 71% +21.8%

Percentiles use an expanding own-history window (no look-ahead); forward return is 240 trading days on adjusted close. Sample days overlap; distribution is indicative only.

Current PE ≈ 120.66, at the 99.9th percentile of its own history (80-100 band).

Valuation × momentum historical grid

Every day in its own history is bucketed by valuation tercile (own-history PE) and 60-day momentum sign into six cells; we show adjusted-close returns over the next 120 trading days per cell.

Valuation
Momentum
Cheap (own-history bottom 1/3)
Mid
Expensive (own-history top 1/3)
60-day momentum up
+12.4%
Win rate 74.1% Excess +9%
263d
+31.4%
Win rate 76.1% Excess +23.9%
373d
Now
+28.9%
Win rate 70.7% Excess +18.2%
1272d
60-day momentum down
+20.5%
Win rate 76.8% Excess +17%
449d
+14.6%
Win rate 49.2% Excess +7%
240d
+17%
Win rate 66.3% Excess +5.9%
483d

Currently in “Expensive (own-history top 1/3) × 60-day momentum up”: across 1272 historical days, 120-day forward avg gained 28.9%, win rate 70.7%, beat the market by 18.2%.

Days = trading days in this bucket; returns use adjusted prices, ex-costs. 60-day momentum: direction of this stock's price over the past 60 trading days.

Does this signal hold up across the market

Over the past 242 months, on average ~404 stocks per month met “monthly revenue YoY ≥ 20%”; their adjusted-close return over the next 60 trading days averaged 6.94% (equal-weighted), beating the market by 2.37 points on average, and outperformed the TAIEX total-return index in 64.5% of months.

Each month, equal-weighted 60-day forward adjusted return of all signal-matching stocks, then averaged across months; excess vs the TAIEX total-return index.

Signals not active (historical stats for reference)

These are not occurring now; historical samples shown for comparison.

252-day price high (breakout)

Pending

Adjusted close makes a new 252-day high; repeats within 20 days counted once.

44 times historically; 60-day forward avg +18.09%, win rate 54.5%, beating the market by +11.13 pts on average.

Foreign net buying for 5 straight days

Pending

Foreign net flow (ex-dealer) positive for 5 straight days; event on day 5; repeats within 20 days counted once.

64 times historically; 60-day forward avg +13.78%, win rate 67.7%, beating the market by +8.32 pts on average.

What does 台燿 do? Company profile

電子零組件業;印刷電路板上游材料,主要為銅箔基板(CCL)、黏合片(Prepreg)與多層壓合代工服務 上櫃(櫃買中心 TPEX)

Overview

6274 對應證券為台燿科技股份有限公司,為櫃買中心上櫃普通股。公司原名台灣聯邦玻璃,成立於1974年5月22日,1997年轉型跨足銅箔基板與黏合片,2001年起增設多層壓合代工服務,2003年12月18日正式上櫃。總部與台灣新竹廠位於新竹縣竹北市博愛街803號,總機03-5551103。董事長為辛忠衡,總經理為陳正益,發言人為黃文旭。公開股市資料顯示實收資本額約新台幣28.88億元,已發行普通股約2.887億股;2026年第一季公司法說會揭露2026年3月31日流通在外股數為288,775仟股。公司官網揭露生產基地包含台灣新竹廠(總公司、研發中心,1997年4月量產CCL/Prepreg,2001年1月量產多層壓合)、江蘇常熟廠(2005年9月量產)、廣東中山廠(2010年1月量產)、泰國春武里府廠(2025年5月量產)。公司官網揭露集團總產能可達銅箔基板每月220萬張、壓合代工每月160萬平方英呎;較早招募資料揭露兩岸員工逾2000名,104/台灣就業通揭露台灣公司員工約1100人,Goodinfo薪資資料揭露2024年非主管職員工人數936人,口徑不同。主要內部持股方面,券商/股市資料顯示董事長辛忠衡持股約11,108張、董監及大股東持股比率約4%上下;完整前十大股東名單仍應以最新年報與股東名簿為準。

Business

台燿是PCB上游基礎材料廠,核心產品為銅箔基板(CCL)、黏合片(Prepreg)與多層壓合代工。CCL是以玻璃纖維布、樹脂等絕緣材料含浸成膠片後,與銅箔疊合並經高溫高壓壓合形成,是製造印刷電路板的關鍵材料。公司產品線涵蓋高頻材料、極低損耗(ELL)、超低損耗(SLL)、Very Low Loss、Low Loss、Mid Loss、Non-flow/Mid-flow Prepreg、高耐熱與標準FR-4材料;應用包括RF基地台/小型基地台、高速數位HSD、伺服器、儲存設備、企業路由器與交換器、100G/400G/800G網通、HDI、AI Computing、手機、消費電子、毫米波、車用77-79GHz感測器、厚銅/高可靠度車用與封裝基板。2025年第4季法說會揭露當季銅箔基板銷售技術別為ELL & SLL 36%、VLL & LL 34%、HDI & N-LL 21%、Others 10%;2025全年銅箔基板銷售技術別為ELL & SLL 36%、VLL & LL 32%、HDI & N-LL 24%、Others 8%,顯示高階低損耗材料已是營收主軸。公司商業模式為材料配方研發、認證、量產與交付給PCB廠及其終端品牌/系統客戶供應鏈;客戶通常需要長時間認證,高階材料黏著度較高。公司未在公開法說逐一揭露主要客戶名稱,因此下游公司多以PCB、網通、伺服器與車用電子供應鏈代表公司列示,未必代表直接銷售關係。

Outlook 2025–2028

2025至2028年主要成長動能來自AI伺服器、高速交換器、資料中心網通升級、ASIC伺服器、400G/800G/1.6T交換器、一般伺服器平台升級與車用/電源相關厚銅材料需求。2024年公司營收已受AI與高速網通需求帶動,2025年第4季法說會顯示單季營收91.25億元、年增44.6%、EPS 3.76元,2025全年高階ELL/SLL與VLL/LL占比合計約68%。2026年第1季法說會顯示2026Q1高階ELL & SLL占比進一步至38%、VLL & LL占32%,反映高階產品比重維持高檔。產能面,公司官網揭露泰國春武里府廠2025年5月量產;市場新聞與法人摘要指出泰國新產能將配合客戶在泰國擴PCB產能,2026年起逐步貢獻,並有泰國與中國常熟後續擴產規劃,部分市場資料稱2027年下半年起新增產能開出,但此屬外部新聞/法人資訊,非本研究逐項由公司公告核驗。技術面,高速低損耗材料、M7/M8/M9等級材料、厚銅材料、低CTE、低介電損耗與高可靠度材料為未來競爭焦點;AI伺服器與交換器層數增加、訊號速率提升,將推升CCL價值量。主要風險包括:AI伺服器與高速網通需求若延後或規格切換不如預期,將影響高階材料拉貨;玻纖布、銅箔、樹脂與銅價等原物料上漲可能壓縮毛利;泰國/常熟擴產初期折舊與良率爬坡可能造成短期成本壓力;匯率波動、客戶認證時程、同業台光電/聯茂/國際材料廠競爭、地緣政治與關稅/供應鏈移轉均為挑戰。2028年展望取決於AI資料中心資本支出延續、800G至1.6T交換器滲透率、CSP自研ASIC伺服器放量、以及公司新產能是否順利達產。

Supply Chain

Upstream
  • 金居開發股份有限公司 8358 台股上櫃銅箔廠;銅箔為CCL主要原料之一,列為產業上游代表,未確認為台燿直接供應商。
  • 南亞塑膠工業股份有限公司 1303 台股上市化工與電子材料廠,產品涵蓋樹脂、銅箔/基板等相關材料;既可能位於上游材料鏈,也在部分CCL領域具競合關係,未確認為直接供應商。
  • 台灣玻璃工業股份有限公司 1802 台股上市玻璃/玻纖相關廠;玻璃纖維布為CCL重要原料,列為上游材料代表,未確認為直接供應商。
  • 長春集團 台灣未上市化工集團;環氧樹脂、酚醛樹脂等化工材料與PCB/CCL供應鏈相關,列為上游化工材料代表,未確認為直接供應商。
  • 日系/美系特殊樹脂、低介電材料與銅箔供應商 高階低損耗CCL常需特殊樹脂、填料、玻纖布與銅箔;具體供應商名稱未由公司公開完整揭露。
Downstream

Competitors

  • 台光電子材料股份有限公司 2383 台股上市高階CCL龍頭之一,AI伺服器與高速網通低損耗材料為主要競爭領域。
  • 聯茂電子股份有限公司 6213 台股上市CCL/Prepreg廠,與台燿同屬PCB上游材料同業。
  • 騰輝電子-KY股份有限公司 6672 台股上市特殊材料/高頻高速基板材料廠,部分應用與台燿競爭。
  • 台虹科技股份有限公司 8039 台股上市軟性銅箔基板與電子材料廠,部分PCB材料應用具競合關係。
  • 南亞塑膠工業股份有限公司 1303 台股上市大型電子材料與化工廠,具銅箔基板/銅箔等相關材料布局,與台燿部分競合。
  • 生益科技 中國上市CCL大廠,非台股掛牌,為全球/中國市場主要競爭者。
  • 建滔積層板 香港上市CCL大廠,非台股掛牌,為全球主要競爭者。
  • Rogers Corporation 美國上市高頻材料廠,非台股掛牌,在高頻/高速材料領域具競爭性。
  • Isola Group 未上市/私有高階PCB材料廠,非台股掛牌,為高速材料國際競爭者。
Sources(18)

This company profile is compiled from public sources (annual reports, filings, news and analyst reports), not finlab backtest data; the 2025–2028 outlook contains forward-looking estimates and is for reference only.

Method and limitations

  • All returns use adjusted close (etl:adj_close), already adjusted for dividends and splits.
  • Excess return is measured against the TAIEX total-return index (dividends included).
  • Valuation regime and percentile stats use an expanding own-history window (no future data).
  • Revenue-signal event dates align to the first trading day after the filing deadline, avoiding look-ahead.
  • Event samples may overlap in time; stats describe historical distribution only and are less reliable when samples are few.

This page is historical statistics for educational purposes and is not investment advice. Investing involves risk; past performance does not indicate future results. Assess and bear the risk yourself before trading.